Professor, Curriculum Chair
Semiconductor Technologies:
3D-ICs, Heterogeneous Integration (HI), Smart System Hyper-Integration;
Hybrid Bonding, TSV, Chiplet Assembly, Glass Interposer, Advanced Packaging, Reliability;
Modeling/Simulation, Power & Signal Integrity;
Nano-Micro-electronics, Materials, Devices, Fabrication & Integration;
THz Devices, Power Devices, Neutron Detectors;
Self-Assembly, LED Display.