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JEC 5038
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akins@rpi.edu
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518-276-3244
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About
Dr. Semih Akin joined the Mechanical, Aerospace, and Nuclear Engineering Department at Rensselaer Polytechnic Institute (RPI) as a tenure-track Assistant Professor in Spring 2024. He earned his Ph.D. in Mechanical Engineering from Purdue University in 2022, where he also worked as a Postdoctoral Fellow before joining RPI. Dr. Akin’s cross-disciplinary research focuses on surface engineering and advanced multi-scale manufacturing. His research has practical applications across various domains, encompassing 3D-printed electronics, smart films, electronic textiles, energy devices, and self-powered sensors.
Ph.D., Purdue University, 2022
Research
The research activities conducted by Dr. Akin's group (SEMI Lab) are centered on three major thrusts:
- Fundamental science on surface-matter interactions
- Manufacturing science for developing robust/resilient manufacturing processes
- Manufacturing innovation for next-generation energy, environmental, aerospace, and defense applications.
Multi-material additive manufacturing, Sustainable repairing, Smart structures, Self-powered sensors, In-space manufacturing
Teaching
Tuesdays 3:00 PM – 5:00 PM
ENGR 2050: Introduction to Engineering Design
Recognition
- Outstanding Graduate Student Research Award, Purdue University, CoE, 2023
- Italian Packaging Technology Award, Italian Trade Agency, 2023
- Ward A. Lambert Graduate Teaching Fellowship, Purdue University, 2022
- Graduate Teaching Award, Purdue University, CoE, 2022
- Frontispiece cover article, Advanced Materials, 2022
- Editor’s choice article, Journal of Thermal Spray Technology, 2021
- Best paper award, World Congress on Micro and Nano Manufacturing (WCMNM), 2021
Publications
The following is a selection of recent publications in Scopus. Semih Akin has 25 indexed publications in the subjects of Engineering, Materials Science, Physics and Astronomy.
Sponsored Projects
Defense Advanced Research Projects Agency (DARPA): SENSE: ”Convergent Manufacturing of Smart Metal Structures with Embedded Sensing Capabilities”, PI: J. Samuel; Co-PIs: S. Akin, F. Kopsaftopoulos, S. Mishra, J. Wen, 01/22/24 - 01/22/26