James J.-Q. Lü

Professor, Curriculum Chair, Electrical, Computer, and Systems Engineering

Education

Dr.rer.nat. (Ph.D.), Technical University of Munich, Germany

Research Focus
  • Semiconductor Technologies:
  • 3D-ICs, Heterogeneous Integration (HI), Smart System Hyper-Integration;
  • Hybrid Bonding, TSV, Chiplet Assembly, Glass Interposer, Advanced Packaging, Reliability;
  • Modeling/Simulation, Power & Signal Integrity;
  • Nano-Micro-electronics, Materials, Devices, Fabrication & Integration;
  • THz Devices, Power Devices, Neutron Detectors;
  • Self-Assembly, LED Display.
Contact Information
Select Works
  • Handbook of Wafer Bonding, http://www.wiley.com/WileyCDA/WileyTitle/productCd-3527326464.html; Wiley-VCH Verlag, March 2012. ISBN: 978-3-527-32646-4.
  • J.-Q. Lu, “3D Hyper-Integration and Packaging Technologies for Micro-Nano-Systems,” Proceedings of The IEEE, “Special Issue: 3D Integration Technology”, 97 (1), pp. 18-30, January 2009. (http://homepages.rpi.edu/~luj/3DHIP_Proc_IEEE_2009.pdf)