Professor, Curriculum Chair, IEEE Fellow
CII - 6229
Education & Training
Dr.rer.nat. (Ph.D.), Technical University of Munich, Germany
Primary Research Focus
3D Heterogeneous Integration (HI) and Advanced Packaging (AP)
Other Focus Areas
Semiconductor Technologies: 3D-ICs, Smart System Hyper-Integration; Hybrid Bonding, Reliability; Modeling/Simulation, Power & Signal Integrity; Nano-Micro-electronics, Materials, Devices, Fabrication & Integration; THz Devices, Power Devices, Neutron Detectors; Self-Assembly, LED Display.