Ken Rose

Electrical, Computer, and Systems Engineering

Publications

The following is a selection of recent publications in Scopus. Ken Rose has 109 indexed publications in the subjects of Engineering, Physics and Astronomy, Materials Science.

Modeling of power delivery into 3D chips on silicon interposer
Zheng Xu, Xiaoxiong Gu, Michael Scheuermann, Kenneth Rose, Buckwell C. Webb, John U. Knickerbocker, Jian Qiang Lu
Proceedings - Electronic Components and Technology Conference
, 2012
, pp.683-689
.
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
Zheng Xu, Xiaoxiong Gu, Michael Scheuermann, Kenneth Rose, Buckwell C. Webb, John U. Knickerbocker, Jian Qiang Lu
Proceedings - Electronic Components and Technology Conference
, 2012
, pp.1819-1825
.
Decoupling capacitor modeling and characterization for power supply noise in 3D systems
Zheng Xu, Christopher Putnam, Xiaoxiong Gu, Michael Scheuermann, Kenneth Rose, Buckwell Webb, John Knickerbocker, Jian Qiang Lu
ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings
, 2012
, pp.414-419
.
Coaxial through-strata-via (TSV) analysis and modeling
Zheng Xu, Adam Beece, Dingyou Zhang, Kenneth Rose, James Lu
IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2011 Spring Conference
, 2011
, pp.2112-2134
.
3D coaxial through-strata-via (TSV) analysis and modeling
Zheng Xu, Adam Beece, Diiigyou Zhang, Kemieth Rose, James J.Q. Lu
IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2011 Spring Conference
, 2011
, pp.300-305
.
Electrical analysis and modeling of 3D through-strata-vias (TSVs) and pads
Zheng Xu, Adam Beece, Kenneth Rose, Jian Qiang Lu
43rd International Symposium on Microelectronics 2010, IMAPS 2010
, 2010
, pp.164-169
.
Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) network
Zheng Xu, Adam Beece, Dingyou Zhang, Qianwen Chen, Kuan Neng Chen, Kenneth Rose, Jian Qiang Lu
IEEE 3D System Integration Conference 2010, 3DIC 2010
, 2010
.
Processing material evaluation and ultra-wideband modeling of through-strata-via (TSV) in 3D integrated circuits and systems
Zheng Xu, Adam Beece, Dingyou Zhang, Qianwen Chen, Kenneth Rose, James Jian Qiang Lu
ICSICT-2010 - 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology, Proceedings
, 2010
, pp.1802-1804
.
Characterization and modeling of solder balls and through-strata-vias (TSVs) in 3D architecture
Zheng Xu, Adam Beece, Dingyou Zhang, Qianwen Chen, Kenneth Rose, Jian Qiang Lu
2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010
, 2010
, pp.37-40
.
Impacts of though-DRAM vias in 3D processor-DRAM integrated systems
Qi Wu, Ken Rose, Jian Qiang Lu, Tong Zhang
2009 IEEE International Conference on 3D System Integration, 3DIC 2009
, 2009
.
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